SEMICONDUCTOR MOLD & DIE LIMITED

Registration No.: 0255807
SEMICONDUCTOR MOLD & DIE LIMITED is a dissolved company incorporated on 21 June 1989 (Wednesday) in Hong Kong as a private company limited by shares entity.
Company Registration No.
0255807
Also Known As
半導體模具製作有限公司
Previously Known As
SEMICONDUCTOR MOLD & DIE LIMITED 半導體模具製作有限公司
SEMICONDUCTOR MOLD & DIES LIMITED 半導體模具製作有限公司
SEMI-CONDUCTOR MOLD & DIES LIMITED 半導體模具製作有限公司
KUK JE MOLD & DIES (INTERNATIONAL) LIMITED
Company Type
Private Company Limited By Shares
Date of Incorporation
21 June 1989 (Wednesday)
Status
Dissolved
Remarks
Dissolved by Deregistration
Winding Up Mode
-
Date of Dissolution
30 July 2004 (Friday)
Register of Charges
Unavailable
Important Note
-